Mastering Thermal Issues in LED PCB Design & Laminate Selection by Ventec Europe

LED applications are not the only applications that are driving the need for thermal issues to be considered and mastered in PCB design, but they are certainly amongst the most challenging. Designing LED PCBs requires many considerations and key are those that arise from multiple heat sources in close proximity. Martin Cotton, Director OEM Technology of Ventec Europe describes the process and criteria used when designing PCBs (Printed Circuit Boards) for use in LED applications using thermally conductive IMS (Insulated Metal Substrates). He goes into technical detail with charts and diagrams that explain everything the designer would need to consider when selecting a laminate and commencing a design.

A PCB design for LED lighting products belongs to the most challenging tasks, a proper process and criteria is very helpful when designing PCBs (Printed Circuit Boards) for use in these applications using thermally conductive IMS (Insulated Metal Substrates). Therefore, the requirements for thermal management and the various issues that form the development of design rules and build structure for the Printed Circuit Board will be outlined in the article. Furthermore, the manufacturers specification and those provided by the laminate vendor are considered to create workable design rules that include coin cavity and adjacency dimensions. It looks at options for thermally conductive laminates; glass reinforced thermally conductive prepregs, thermally conductive dielectrics and IMS (Insulated Metal Substrates) materials.

A focus is on the make-up of these IMS in the form of copper-laminate-aluminum or copper-laminate-copper, considering the various characteristics, benefits and the thermal conductivity and impedance of each option.